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Author |
Title |
Year |
Publication |
Volume |
Times cited |
Additional Links |
Links |
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Paulus, A.; Hendrickx, M.; Mayda, S.; Batuk, M.; Reekmans, G.; von Holst, M.; Elen, K.; Abakumov, A.M.; Adriaensens, P.; Lamoen, D.; Partoens, B.; Hadermann, J.; Van Bael, M.K.; Hardy, A. |
Understanding the Activation of Anionic Redox Chemistry in Ti4+-Substituted Li2MnO3as a Cathode Material for Li-Ion Batteries |
2023 |
ACS applied energy materials |
6 |
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UA library record; WoS full record; WoS citing articles |
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Saeumel, I.; Ramirez, L.R.; Santolin, J.; Pintado, K. |
A step to disentangle diversity patterns in Uruguayan grasslands : climatic seasonality, novel land-uses, and landscape context drive diversity of ground flora |
2023 |
Conservation Science and Practice |
5 |
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UA library record; WoS full record |
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Carrasco, S.; Orcajo, G.; Martínez, F.; Imaz, I.; Kavak, S.; Arenas-Esteban, D.; Maspoch, D.; Bals, S.; Calleja, G.; Horcajada, P. |
Hf/porphyrin-based metal-organic framework PCN-224 for CO2 cycloaddition with epoxides |
2023 |
Materials Today Advances |
19 |
1 |
UA library record; WoS full record; WoS citing articles |
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Rakesh Roshan, S.C.; Yedukondalu, N.; Pandey, T.; Kunduru, L.; Muthaiah, R.; Rajaboina, R.K.; Ehm, L.; Parise, J.B. |
Effect of atomic mass contrast on lattice thermal conductivity : a case study for alkali halides and alkaline-earth chalcogenides |
2023 |
ACS applied electronic materials |
5 |
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UA library record; WoS full record |
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Vlasov, E.; Skorikov, A.; Sánchez-Iglesias, A.; Liz-Marzán, L.M.; Verbeeck, J.; Bals, S. |
Secondary electron induced current in scanning transmission electron microscopy: an alternative way to visualize the morphology of nanoparticles |
2023 |
ACS materials letters |
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1 |
UA library record; WoS full record; WoS citing articles |
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Hugenschmidt, M.; Jannis, D.; Kadu, A.A.; Grünewald, L.; De Marchi, S.; Perez-Juste, J.; Verbeeck, J.; Van Aert, S.; Bals, S. |
Low-dose 4D-STEM tomography for beam-sensitive nanocomposites |
2023 |
ACS materials letters |
6 |
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UA library record; WoS full record |
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Zheng, J.; Zhang, H.; Lv, J.; Zhang, M.; Wan, J.; Gerrits, N.; Wu, A.; Lan, B.; Wang, W.; Wang, S.; Tu, X.; Bogaerts, A.; Li, X. |
Enhanced NH3Synthesis from Air in a Plasma Tandem-Electrocatalysis System Using Plasma-Engraved N-Doped Defective MoS2 |
2023 |
JACS Au |
3 |
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UA library record; WoS full record; WoS citing articles |
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Bhatia, H.; Keshavarz, M.; Martin, C.; Van Gaal, L.; Zhang, Y.; de Coen, B.; Schrenker, N.J.; Valli, D.; Ottesen, M.; Bremholm, M.; Van de Vondel, J.; Bals, S.; Hofkens, J.; Debroye, E. |
Achieving High Moisture Tolerance in Pseudohalide Perovskite Nanocrystals for Light-Emitting Diode Application |
2023 |
ACS Applied Optical Materials |
1 |
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UA library record |
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Mary Joy, R.; Pobedinskas, P.; Bourgeois, E.; Chakraborty, T.; Görlitz, J.; Herrmann, D.; Noël, C.; Heupel, J.; Jannis, D.; Gauquelin, N.; D'Haen, J.; Verbeeck, J.; Popov, C.; Houssiau, L.; Becher, C.; Nesládek, M.; Haenen, K. |
Germanium vacancy centre formation in CVD nanocrystalline diamond using a solid dopant source |
2023 |
Science talks |
5 |
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UA library record |
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Deylgat, E.; Chen, E.; Sorée, B.; Vandenberghe, W.G. |
Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials |
2023 |
International Conference on Simulation of Semiconductor Processes and Devices : [proceedings]
T2 – International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan |
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UA library record; WoS full record |
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Mescia, L.; Bia, P.; Gielis, J.; Caratelli, D. |
Advanced particle swarm optimization methods for electromagnetics |
2023 |
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UA library record |
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Gielis, J. |
Conquering Mount Improbable |
2023 |
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UA library record |
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Gielis, J.; Tavkhelidze, I. |
A note on Generalized Möbius-Listing Bodies |
2023 |
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UA library record |
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Reyntjens, P.; Van de Put, M.; Vandenberghe, W.G.; Sorée, B. |
Ultrascaled graphene-capped interconnects : a quantum mechanical study |
2023 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany |
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UA library record; WoS full record |
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Koirala, B.; Rasti, B.; Bnoulkacem, Z.; De Lima Ribeiro, A.; Madriz, Y.; Herrmann, E.; Gestels, A.; De Kerf, T.; Janssens, K.; Steenackers, G.; Gloaguen, R.; Scheunders, P. |
An extensive multisensor hyperspectral benchmark datasets of intimate mixtures of mineral powders |
2023 |
IEEE International Geoscience and Remote Sensing Symposium proceedings
T2 – IGARSS 2023 – 2023 IEEE International Geoscience and Remote Sensing Symposium, 16-21 July 2023, Pasadena, CA, USA |
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UA library record; WoS full record |
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