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Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2plasmas”. Tinck S, Tillocher T, Georgieva V, Dussart R, Neyts E, Bogaerts A, Plasma processes and polymers 14, 1700018 (2017). http://doi.org/10.1002/ppap.201700018
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Pressure as an additional control handle for non-thermal atmospheric plasma processes”. Belov I, Paulussen S, Bogaerts A, Plasma processes and polymers 14, 1700046 (2017). http://doi.org/10.1002/ppap.201700046
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Phosphatidylserine flip-flop induced by oxidation of the plasma membrane: a better insight by atomic scale modeling”. Razzokov J, Yusupov M, Vanuytsel S, Neyts EC, Bogaerts A, Plasma processes and polymers 14, 1700013 (2017). http://doi.org/10.1002/ppap.201700013
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Investigation of plasma-induced chemistry in organic solutions for enhanced electrospun PLA nanofibers”. Rezaei F, Gorbanev Y, Chys M, Nikiforov A, Van Hulle SWH, Cos P, Bogaerts A, De Geyter N, Plasma processes and polymers 15, 1700226 (2018). http://doi.org/10.1002/ppap.201700226
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Impact of plasma oxidation on structural features of human epidermal growth factor”. Yusupov M, Lackmann J-W, Razzokov J, Kumar S, Stapelmann K, Bogaerts A, Plasma processes and polymers 15, 1800022 (2018). http://doi.org/10.1002/ppap.201800022
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White paper on the future of plasma science in environment, for gas conversion and agriculture”. Brandenburg R, Bogaerts A, Bongers W, Fridman A, Fridman G, Locke BR, Miller V, Reuter S, Schiorlin M, Verreycken T, Ostrikov KK, Plasma processes and polymers 16, 1700238 (2019). http://doi.org/10.1002/ppap.201700238
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Ceramide cross-linking leads to pore formation: Potential mechanism behind CAP enhancement of transdermal drug delivery”. Van der Paal J, Fridman G, Bogaerts A, Plasma processes and polymers 16, 1900122 (2019). http://doi.org/10.1002/PPAP.201900122
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The penetration of reactive oxygen and nitrogen species across the stratum corneum”. Duan J, Ma M, Yusupov M, Cordeiro RM, Lu X, Bogaerts A, Plasma Processes And Polymers (2020). http://doi.org/10.1002/ppap.202000005
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Positive and negative streamer propagation in volume dielectric barrier discharges with planar and porous electrodes”. Zhang Q‐Z, Zhang L, Yang D‐Z, Schulze J, Wang Y‐N, Bogaerts A, Plasma Processes And Polymers 18, 2000234 (2021). http://doi.org/10.1002/ppap.202000234
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Molecular understanding of the possible mechanisms of oligosaccharide oxidation by cold plasma”. Yusupov M, Dewaele D, Attri P, Khalilov U, Sobott F, Bogaerts A, Plasma processes and polymers (2022). http://doi.org/10.1002/ppap.202200137
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Toward defining plasma treatment dose : the role of plasma treatment energy of pulsed‐dielectric barrier discharge in dictating in vitro biological responses”. Lin A, Biscop E, Gorbanev Y, Smits E, Bogaerts A, Plasma Processes And Polymers 19, e2100151 (2022). http://doi.org/10.1002/PPAP.202100151
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Modelling the dynamics of hydrogen synthesis from methane in nanosecond‐pulsed plasmas”. Morais E, Bogaerts A, Plasma processes and polymers 21 (2024). http://doi.org/10.1002/ppap.202300149
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A 2D model for a gliding arc discharge”. Kolev S, Bogaerts A, Plasma sources science and technology 24, 015025 (2015). http://doi.org/10.1088/0963-0252/24/1/015025
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Characterization of an Ar/O2 magnetron plasma by a multi-species Monte Carlo model”. Bultinck E, Bogaerts A, Plasma sources science and technology 20, 045013 (2011). http://doi.org/10.1088/0963-0252/20/4/045013
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Comprehensive modelling network for dc glow discharges in argon”. Bogaerts A, Plasma sources science and technology 8, 210 (1999). http://doi.org/10.1088/0963-0252/8/2/003
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Computer simulations of an oxygen inductively coupled plasma used for plasma-assisted atomic layer deposition”. Tinck S, Bogaerts A, Plasma sources science and technology 20, 015008 (2011). http://doi.org/10.1088/0963-0252/20/1/015008
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Conversion of carbon dioxide to value-added chemicals in atmospheric pressure dielectric barrier discharges”. Paulussen S, Verheyde B, Tu X, De Bie C, Martens T, Petrovic D, Bogaerts A, Sels B, Plasma sources science and technology 19, 034015 (2010). http://doi.org/10.1088/0963-0252/19/3/034015
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Dielectric barrier discharges used for the conversion of greenhouse gases: modeling the plasma chemistry by fluid simulations”. De Bie C, Martens T, van Dijk J, Paulussen S, Verheyde B, Corthals S, Bogaerts A, Plasma sources science and technology 20, 024008 (2011). http://doi.org/10.1088/0963-0252/20/2/024008
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Dimension reduction of non-equilibrium plasma kinetic models using principal component analysis”. Peerenboom K, Parente A, Kozák T, Bogaerts A, Degrez G, Plasma sources science and technology 24, 025004 (2015). http://doi.org/10.1088/0963-0252/24/2/025004
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The effect of F2 attachment by low-energy electrons on the electron behaviour in an Ar/CF4 inductively coupled plasma”. Zhao S-X, Gao F, Wang Y-N, Bogaerts A, Plasma sources science and technology 21, 025008 (2012). http://doi.org/10.1088/0963-0252/21/2/025008
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Electron bounce resonance heating in dual-frequency capacitively coupled oxygen discharges”. Liu Y-X, Zhang Q-Z, Liu L, Song Y-H, Bogaerts A, Wang Y-N, Plasma sources science and technology 22, 025012 (2013). http://doi.org/10.1088/0963-0252/22/2/025012
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Electron energy distribution function in capacitively coupled RF discharges: differences between electropositive Ar and electronegative SiH4 discharges”. Yan M, Bogaerts A, Goedheer WJ, Gijbels R, Plasma sources science and technology 9, 583 (2000). http://doi.org/10.1088/0963-0252/9/4/314
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Etching of low-k materials for microelectronics applications by means of a N2/H2 plasma : modeling and experimental investigation”. Van Laer K, Tinck S, Samara V, de Marneffe JF, Bogaerts A, Plasma sources science and technology 22, 025011 (2013). http://doi.org/10.1088/0963-0252/22/2/025011
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Evaluation of the energy efficiency of CO2 conversion in microwave discharges using a reaction kinetics model”. Kozák T, Bogaerts A, Plasma sources science and technology 24, 015024 (2015). http://doi.org/10.1088/0963-0252/24/1/015024
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Gas ratio effects on the Si etch rate and profile uniformity in an inductively coupled Ar/CF4 plasma”. Zhao S-X, Gao F, Wang Y-N, Bogaerts A, Plasma sources science and technology 22, 015017 (2013). http://doi.org/10.1088/0963-0252/22/1/015017
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Heating mechanism in direct current superposed single-frequency and dual-frequency capacitively coupled plasmas”. Zhang Q-Z, Liu Y-X, Jiang W, Bogaerts A, Wang Y-N, Plasma sources science and technology 22, 025014 (2013). http://doi.org/10.1088/0963-0252/22/2/025014
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Hollow cathode discharges with gas flow: numerical modelling for the effect on the sputtered atoms and the deposition flux”. Bogaerts A, Okhrimovskyy A, Baguer N, Gijbels R, Plasma sources science and technology 14, 191 (2005). http://doi.org/10.1088/0963-0252/14/1/021
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The ion- and atom-induced secondary electron emission yield: numerical study for the effect of clean and dirty cathode surfaces”. Bogaerts A, Gijbels R, Plasma sources science and technology 11, 27 (2002). http://doi.org/10.1088/0963-0252/11/1/303
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Modeling Cl2/O2/Ar inductively coupled plasmas used for silicon etching : effects of SiO2 chamber wall coating”. Tinck S, Boullart W, Bogaerts A, Plasma sources science and technology 20, 045012 (2011). http://doi.org/10.1088/0963-0252/20/4/045012
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Plasma characteristics of an Ar/CF4/N2 discharge in an asymmetric dual frequency reactor: numerical investigation by a PIC/MC model”. Georgieva V, Bogaerts A, Plasma sources science and technology 15, 368 (2006). http://doi.org/10.1088/0963-0252/15/3/010
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