| |
Author  |
Title |
Year |
Publication |
Volume |
Times cited |
Additional Links |
Links |
|
|
Zhang, Q.-Z.; Wang, W.-Z.; Bogaerts, A. |
Importance of surface charging during plasma streamer propagation in catalyst pores |
2018 |
Plasma sources science and technology |
27 |
13 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhang, Q.-Z.; Wang, W.Z.; Thille, C.; Bogaerts, A. |
H2S Decomposition into H2 and S2 by Plasma Technology: Comparison of Gliding Arc and Microwave Plasma |
2020 |
Plasma Chemistry And Plasma Processing |
40 |
|
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhang, Q.‐Z.; Zhang, L.; Yang, D.‐Z.; Schulze, J.; Wang, Y.‐N.; Bogaerts, A. |
Positive and negative streamer propagation in volume dielectric barrier discharges with planar and porous electrodes |
2021 |
Plasma Processes And Polymers |
18 |
|
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhang, Y.-R.; Neyts, E.C.; Bogaerts, A. |
Enhancement of plasma generation in catalyst pores with different shapes |
2018 |
Plasma sources science and technology |
27 |
11 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhang, Y.-R.; Xu, X.; Zhao, S.-X.; Bogaerts, A.; Wang, Y.-N. |
Comparison of electrostatic and electromagnetic simulations for very high frequency plasmas |
2010 |
Physics of plasmas |
17 |
30 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhang, Y.; Wang, H.-yu; Zhang, Y.-ru; Bogaerts, A. |
Formation of microdischarges inside a mesoporous catalyst in dielectric barrier discharge plasmas |
2017 |
Plasma sources science and technology |
26 |
15 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhao, S.-X.; Gao, F.; Wang, Y.-N.; Bogaerts, A. |
The effect of F2 attachment by low-energy electrons on the electron behaviour in an Ar/CF4 inductively coupled plasma |
2012 |
Plasma sources science and technology |
21 |
23 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Zhao, S.-X.; Gao, F.; Wang, Y.-N.; Bogaerts, A. |
Gas ratio effects on the Si etch rate and profile uniformity in an inductively coupled Ar/CF4 plasma |
2013 |
Plasma sources science and technology |
22 |
11 |
UA library record; WoS full record; WoS citing articles |
|
