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Author |
Title |
Year  |
Publication |
Volume |
Times cited |
Additional Links |
Links |
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Adelmann, C.; Sankaran, K.; Dutta, S.; Gupta, A.; Kundu, S.; Jamieson, G.; Moors, K.; Pinna, N.; Ciofi, I.; Van Elshocht, S.; Bommels, J.; Boccardi, G.; Wilson, C.J.; Pourtois, G.; Tokei, Z. |
Alternative Metals: from ab initio Screening to Calibrated Narrow Line Models |
2018 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA |
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UA library record; WoS full record; WoS citing articles |
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Contino, A.; Ciofi, I.; Wu, X.; Asselberghs, I.; Celano, U.; Wilson, C.J.; Tokei, Z.; Groeseneken, G.; Sorée, B. |
Modeling of edge scattering in graphene interconnects |
2018 |
IEEE electron device letters |
39 |
1 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Sankaran, K.; Moors, K.; Dutta, S.; Adelmann, C.; Tokei, Z.; Pourtois, G. |
Metallic ceramics for low resitivity interconnects : an ab initio insight |
2018 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA |
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|
UA library record; WoS full record; WoS citing articles |
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Dutta, S.; Sankaran, K.; Moors, K.; Pourtois, G.; Van Elshocht, S.; Bommels, J.; Vandervorst, W.; Tokei, Z.; Adelmann, C. |
Thickness dependence of the resistivity of platinum-group metal thin films |
2017 |
Journal of applied physics |
122 |
42 |
UA library record; WoS full record; WoS citing articles |
|
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Moors, K.; Soree, B.; Tokei, Z.; Magnus, W. |
Electron relaxation times and resistivity in metallic nanowires due to tilted grain boundary planes |
2015 |
On Ultimate Integration On Silicon (eurosoi-ulis) |
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|
UA library record; WoS full record; WoS citing articles |
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Moors, K.; Sorée, B.; Tokei, Z.; Magnus, W. |
Resistivity scaling and electron relaxation times in metallic nanowires |
2014 |
Journal of applied physics |
116 |
17 |
UA library record; WoS full record; WoS citing articles |
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|
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Sankaran, K.; Clima, S.; Mees, M.; Adelmann, C.; Tokei, Z.; Pourtois, G. |
Exploring alternative metals to Cu and W for interconnects : an ab initio Insight |
2014 |
2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference (iitc/amc) |
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UA library record; WoS full record; |
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Tokei, Z.; Lanckmans, F.; van den Bosch, G.; Van Hove, M.; Maex, K.; Bender, H.; Hens, S.; van Landuyt, J. |
Reliability of copper dual damascene influenced by pre-clean |
2002 |
Analysis Of Integrated Circuits |
|
5 |
UA library record; WoS full record; WoS citing articles |
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