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Author |
Title |
Year |
Publication |
Volume |
Times cited |
Additional Links |
Links |
|
|
Tokei, Z.; Lanckmans, F.; van den Bosch, G.; Van Hove, M.; Maex, K.; Bender, H.; Hens, S.; van Landuyt, J. |
Reliability of copper dual damascene influenced by pre-clean |
2002 |
Analysis Of Integrated Circuits |
|
5 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Stuer, G.; Bender, H.; van Landuyt, J.; Eyben, P. |
Stress analysis with convergent beam electron diffraction around NMOS transistors |
2001 |
|
|
|
UA library record; WoS full record; |
|
|
|
Ghica, C.; Nistor, L.C.; Bender, H.; Richard, O.; Van Tendeloo, G.; Ulyashin, A. |
TEM characterization of extended defects induced in Si wafers by H-plasma treatment |
2007 |
Journal of physics: D: applied physics |
40 |
10 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Nistor, L.C.; Richard, O.; Zhao, C.; Bender, H.; Van Tendeloo, G. |
Thermal stability of atomic layer deposited Zr:Al mixed oxide thin films: an in situ transmission electron microscopy study |
2005 |
Journal of materials research |
20 |
|
UA library record; WoS full record |
|
