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Author |
Title |
Year  |
Publication |
Volume |
Times cited |
Additional Links |
Links |
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|
Reyntjens, P.; Van de Put, M.; Vandenberghe, W.G.; Sorée, B. |
Ultrascaled graphene-capped interconnects : a quantum mechanical study |
2023 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany |
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UA library record; WoS full record |
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Reyntjens, P.D.; Tiwari, S.; van de Put, M.L.; Sorée, B.; Vandenberghe, W.G. |
Ab-initio study of magnetically intercalated platinum diselenide : the impact of platinum vacancies |
2021 |
Materials |
14 |
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UA library record; WoS full record; WoS citing articles |
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Reyntjens, P.D.; Tiwari, S.; van de Put, M.L.; Sorée, B.; Vandenberghe, W.G. |
Magnetic properties and critical behavior of magnetically intercalated WSe₂ : a theoretical study |
2021 |
2d Materials |
8 |
1 |
UA library record; WoS full record; WoS citing articles |
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Reyntjens, P.D.; Tiwari, S.; Van de Put, M.L.; Sorée, B.; Vandenberghe, W.G. |
Ab-initio study of magnetically intercalated Tungsten diselenide |
2020 |
International Conference on Simulation of Semiconductor Processes and Devices : [proceedings]
T2 – International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 23-OCT 06, 2020 |
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UA library record; WoS full record |
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