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Author |
Title |
Year  |
Publication |
Volume |
Times cited |
Additional Links |
Links |
|
|
Vereecke, B.; van der Veen, M.H.; Sugiura, M.; Kashiwagi, Y.; Ke, X.; Cott, D.J.; Hantschel, T.; Huyghebaert, C.; Tökei, Z. |
Wafer-level electrical evaluation of vertical carbon nanotube bundles as a function of growth temperature |
2013 |
Japanese journal of applied physics |
52 |
5 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Schulze, A.; Hantschel, T.; Dathe, A.; Eyben, P.; Ke, X.; Vandervorst, W. |
Electrical tomography using atomic force microscopy and its application towards carbon nanotube-based interconnects |
2012 |
Nanotechnology |
23 |
29 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Ke, X.; Bals, S.; Cott, D.; Hantschel, T.; Bender, H.; Van Tendeloo, G. |
Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts |
2010 |
Microscopy and microanalysis |
16 |
42 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Ke, X.; Bals, S.; Romo Negreira, A.; Hantschel, T.; Bender, H.; Van Tendeloo, G. |
TEM sample preparation by FIB for carbon nanotube interconnects |
2009 |
Ultramicroscopy |
109 |
21 |
UA library record; WoS full record; WoS citing articles |
|
