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Author Ke, X.; Bals, S.; Cott, D.; Hantschel, T.; Bender, H.; Van Tendeloo, G. doi  openurl
  Title Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts Type A1 Journal article
  Year (down) 2010 Publication Microscopy and microanalysis Abbreviated Journal Microsc Microanal  
  Volume 16 Issue 2 Pages 210-217  
  Keywords A1 Journal article; Electron microscopy for materials research (EMAT)  
  Abstract The three-dimensional (3D) distribution of carbon nanotubes (CNTs) grown inside semiconductor contact holes is studied by electron tomography. The use of a specialized tomography holder results in an angular tilt range of ±90°, which means that the so-called missing wedge is absent. The transmission electron microscopy (TEM) sample for this purpose consists of a micropillar that is prepared by a dedicated procedure using the focused ion beam (FIB) but keeping the CNTs intact. The 3D results are combined with energy dispersive X-ray spectroscopy (EDS) to study the relation between the CNTs and the catalyst particles used during their growth. The reconstruction, based on the full range of tilt angles, is compared with a reconstruction where a missing wedge is present. This clearly illustates that the missing wedge will lead to an unreliable interpretation and will limit quantitative studies  
  Address  
  Corporate Author Thesis  
  Publisher Place of Publication Cambridge, Mass. Editor  
  Language Wos 000276137200011 Publication Date 2010-02-26  
  Series Editor Series Title Abbreviated Series Title  
  Series Volume Series Issue Edition  
  ISSN 1431-9276;1435-8115; ISBN Additional Links UA library record; WoS full record; WoS citing articles  
  Impact Factor 1.891 Times cited 42 Open Access  
  Notes Esteem 026019; Fwo; Iap-Vi Approved Most recent IF: 1.891; 2010 IF: 3.259  
  Call Number UA @ lucian @ c:irua:82279 Serial 3642  
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