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Effect of selenium content of CuInSex alloy nanopowder precursors on recrystallization of printed CuInSe2 absorber layers during selenization heat treatment”. E Zaghi A, Buffière M, Koo J, Brammertz G, Batuk M, Verbist C, Hadermann J, Kim WK, Meuris M, Poortmans J, Vleugels J;, Thin solid films : an international journal on the science and technology of thin and thick films , 1 (2014). http://doi.org/10.1016/j.tsf.2014.10.003
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Exploring alternative metals to Cu and W for interconnects : an ab initio Insight”. Sankaran K, Clima S, Mees M, Adelmann C, Tokei Z, Pourtois G, 2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference (iitc/amc) , 193 (2014)
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High resolution electron microscopy from imaging towards measuring”. Van Aert S, den Dekker AJ, van den Bos A, Van Dyck D ... IEEE International Instrumentation and Measurement Technology Conference T2 – Rediscovering measurement in the age of informatics : proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference (IMTC), 2001: vol 3. Ieee, page 2081 (2001).
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Reporter gene-expressing bone marrow-derived stromal cells are immune-tolerated following implantation in the central nervous system of syngeneic immunocompetent mice”. Bergwerf I, de Vocht N, Tambuyzer B, Verschueren J, Reekmans K, Daans J, Ibrahimi A, Van Tendeloo V, Chatterjee S, Goossens H, Jorens PG, Baekelandt V, Ysebaert D, Van Marck E, Berneman ZN, Van Der Linden A, Ponsaerts P, BMC biotechnology (2009). http://doi.org/10.1186/1472-6750-9-1
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Strain measurement in semiconductor FinFET devices using a novel moiré, demodulation technique”. Prabhakara V, Jannis D, Béché, A, Bender H, Verbeeck J, Semiconductor science and technology (2019). http://doi.org/10.1088/1361-6641/ab5da2
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Storage, fertilization and cost properties highlight the potential of dried microbial biomass as organic fertilizer”. Spanoghe J, Grunert O, Wambacq E, Sakarika M, Papini G, Alloul A, Spiller M, Derycke V, Stragier L, Verstraete H, Fauconnier K, Verstraete W, Haesaert G, Vlaeminck SE, Microbial biotechnology , 1 (2020). http://doi.org/10.1111/1751-7915.13554
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Strain, electric-field and functionalization induced widely tunable electronic properties in MoS2/BC3, /C3N and / C3N4 van der Waals heterostructures”. Bafekry A, Stampfl C, Ghergherehchi M, Nanotechnology (Bristol. Print) , 295202 pp (2020). http://doi.org/10.1088/1361-6528/AB884E
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Crack initiation in tapered high Si stainless steel specimens : stress threshold analyses”. Penders A, Konstantinovic MJ, Bosch RW, Schryvers D, Corrosion Engineering Science And Technology , 1 (2020). http://doi.org/10.1080/1478422X.2020.1785651
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Facile dry coating method of high-nickel cathode material by nanostructured fumed alumina (Al2O3) improving the performance of lithium-ion batteries”. Herzog MJ, Gauquelin N, Esken D, Verbeeck J, Janek J, Energy technology 9, 2100028 (2021). http://doi.org/10.1002/ENTE.202100028
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TEM investigation of SCC crack tips in high Si stainless steel tapered specimens”. Penders A, Konstantinovic MJ, Van Renterghem W, Bosch RW, Schryvers D, Corrosion Engineering Science And Technology (2021). http://doi.org/10.1080/1478422X.2021.1961665
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Foundations of plasma catalysis for environmental applications”. Bogaerts A, Neyts EC, Guaitella O, Murphy AB, Plasma Sources Science &, Technology (2022). http://doi.org/10.1088/1361-6595/ac5f8e
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A database system for querying of river networks : facilitating monitoring and prediction applications”. Bollen E, Pagan BR, Kuijpers B, Van Hoey S, Desmet N, Hendrix R, Dams J, Seuntjens P, Water Science And Technology-Water Supply (2021). http://doi.org/10.2166/WS.2021.433
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Alternative Metals: from ab initio Screening to Calibrated Narrow Line Models”. Adelmann C, Sankaran K, Dutta S, Gupta A, Kundu S, Jamieson G, Moors K, Pinna N, Ciofi I, Van Elshocht S, Bommels J, Boccardi G, Wilson CJ, Pourtois G, Tokei Z, Proceedings of the IEEE ... International Interconnect Technology Conference T2 –, IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA , 154 (2018). http://doi.org/10.1109/IITC.2018.8456484
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Metallic ceramics for low resitivity interconnects : an ab initio insight”. Sankaran K, Moors K, Dutta S, Adelmann C, Tokei Z, Pourtois G, Proceedings of the IEEE ... International Interconnect Technology Conference T2 –, IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA , 160 (2018)
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Titanium (germano-)silicides featuring 10-9 Ω.cm2 contact resistivity and improved compatibility to advanced CMOS technology”. Yu H, Schaekers M, Chew SA, Eyeraert J-L, Dabral A, Pourtois G, Horiguchi N, Mocuta D, Collaert N, De Meyer K, 2018 18th International Workshop On Junction Technology (iwjt) , 80 (2018)
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Ultrascaled graphene-capped interconnects : a quantum mechanical study”. Reyntjens P, Van de Put M, Vandenberghe WG, Sorée B, Proceedings of the IEEE ... International Interconnect Technology Conference T2 –, IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany , 1 (2023). http://doi.org/10.1109/IITC/MAM57687.2023.10154656
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Heterogeneous Pt-catalyzed transfer dehydrogenation of long-chain alkanes with ethylene”. de la Croix T, Claes N, Eyley S, Thielemans W, Bals S, De Vos D, Catalysis Science &, Technology (2023). http://doi.org/10.1039/D3CY00370A
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