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Quasi-Neutral Modeling of Gliding Arc Plasmas: Quasi-Neutral Modeling of Gliding Arc Plasmas”. Kolev S, Sun S, Trenchev G, Wang W, Wang H, Bogaerts A, Plasma processes and polymers 14, 1600110 (2017). http://doi.org/10.1002/ppap.201600110
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Plasma processes and polymers third special issue on plasma and cancer”. Laroussi M, Bogaerts A, Barekzi N, Plasma processes and polymers 13, 1142 (2016). http://doi.org/10.1002/ppap.201600193
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Toward defining plasma treatment dose : the role of plasma treatment energy of pulsed‐dielectric barrier discharge in dictating in vitro biological responses”. Lin A, Biscop E, Gorbanev Y, Smits E, Bogaerts A, Plasma Processes And Polymers 19, e2100151 (2022). http://doi.org/10.1002/PPAP.202100151
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Modeling and tackling resistivity scaling in metal nanowires”. Moors K, Sorée B, Magnus W, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 09-11, 2015, Washington, DC , 222 (2015)
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Modelling the dynamics of hydrogen synthesis from methane in nanosecond‐pulsed plasmas”. Morais E, Bogaerts A, Plasma processes and polymers 21 (2024). http://doi.org/10.1002/ppap.202300149
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Modeling PECVD growth of nanostructured carbon materials”. Neyts E, Bogaerts A, van de Sanden MCM, High temperature material processes 13, 399 (2009). http://doi.org/10.1615/HighTempMatProc.v13.i3-4.120
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Effect of electric fields on plasma catalytic hydrocarbon oxidation from atomistic simulations”. Neyts EC, Bal KM, Plasma processes and polymers 14, e1600158 (2017). http://doi.org/10.1002/PPAP.201600158
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Molecular Dynamics Simulations for Plasma-Surface Interactions: Molecular Dynamics Simulations…”. Neyts EC, Brault P, Plasma processes and polymers 14, 1600145 (2017). http://doi.org/10.1002/ppap.201600145
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Special issue: Plasma Conversion”. Nozaki T, Bogaerts A, Tu X, Sanden R, Plasma processes and polymers 14, 1790061 (2017). http://doi.org/10.1002/ppap.201790061
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Effect of argon or helium on the CO2 conversion in a dielectric barrier discharge”. Ramakers M, Michielsen I, Aerts R, Meynen V, Bogaerts A, Plasma processes and polymers 12, 755 (2015). http://doi.org/10.1002/ppap.201400213
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Phosphatidylserine flip-flop induced by oxidation of the plasma membrane: a better insight by atomic scale modeling”. Razzokov J, Yusupov M, Vanuytsel S, Neyts EC, Bogaerts A, Plasma processes and polymers 14, 1700013 (2017). http://doi.org/10.1002/ppap.201700013
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Ab-initio study of magnetically intercalated Tungsten diselenide”. Reyntjens PD, Tiwari S, Van de Put ML, Sorée B, Vandenberghe WG, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 23-OCT 06, 2020 , 97 (2020). http://doi.org/10.23919/SISPAD49475.2020.9241592
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Investigation of plasma-induced chemistry in organic solutions for enhanced electrospun PLA nanofibers”. Rezaei F, Gorbanev Y, Chys M, Nikiforov A, Van Hulle SWH, Cos P, Bogaerts A, De Geyter N, Plasma processes and polymers 15, 1700226 (2018). http://doi.org/10.1002/ppap.201700226
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Influence of Al content on the properties of MgO grown by reactive magnetron sputtering”. Saraiva M, Chen H, Leroy WP, Mahieu S, Jehanathan N, Lebedev O, Georgieva V, Persoons R, Depla D, Plasma processes and polymers 6, S751 (2009). http://doi.org/10.1002/ppap.200931809
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Plasma-based liquefaction of methane: The road from hydrogen production to direct methane liquefaction”. Snoeckx R, Rabinovich A, Dobrynin D, Bogaerts A, Fridman A, Plasma processes and polymers 14, 1600115 (2017). http://doi.org/10.1002/ppap.201600115
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Incorporation of fluorescent dyes in atmospheric pressure plasma coatings for in-line monitoring of coating homogeneity”. Somers W, Dubreuil MF, Neyts EC, Vangeneugden D, Bogaerts A, Plasma processes and polymers 11, 678 (2014). http://doi.org/10.1002/ppap.201300178
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Plasma‐treated liquids in medicine: Let's get chemical”. Tampieri F, Gorbanev Y, Sardella E, Plasma Processes and Polymers 20, e2300077 (2023). http://doi.org/10.1002/ppap.202300077
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The effect of O2 in a humid O2/N2/NOx gas mixture on NOx and N2O remediation by an atmospheric pressure dielectric barrier discharge”. Teodoru S, Kusano Y, Bogaerts A, Plasma processes and polymers 9, 652 (2012). http://doi.org/10.1002/ppap.201100187
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Formation of a nanoscale SiO2 capping layer on photoresist lines with an Ar/SiCl4/O2 inductively coupled plasma : a modeling investigation”. Tinck S, Altamirano-Sánchez E, De Schepper P, Bogaerts A, Plasma processes and polymers 11, 52 (2014). http://doi.org/10.1002/ppap.201300062
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Modeling SiH4/O2/Ar inductively coupled plasmas used for filling of microtrenches in shallow trench isolation (STI)”. Tinck S, Bogaerts A, Plasma processes and polymers 9, 522 (2012). http://doi.org/10.1002/ppap.201100093
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Simultaneous etching and deposition processes during the etching of silicon with a Cl2/O2/Ar inductively coupled plasma”. Tinck S, Bogaerts A, Shamiryan D, Plasma processes and polymers 8, 490 (2011). http://doi.org/10.1002/ppap.201000189
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Numerical investigation of SiO2 coating deposition in wafer processing reactors with SiCl4/O2/Ar inductively coupled plasmas”. Tinck S, De Schepper P, Bogaerts A, Plasma processes and polymers 10, 714 (2013). http://doi.org/10.1002/ppap.201300005
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Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2plasmas”. Tinck S, Tillocher T, Georgieva V, Dussart R, Neyts E, Bogaerts A, Plasma processes and polymers 14, 1700018 (2017). http://doi.org/10.1002/ppap.201700018
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Do ICP-MS based methods fulfill the EU monitoring requirements for the determination of elements in our environment?”.Tirez K, Vanhoof C, Bronders J, Seuntjens P, Bleux N, Berghmans P, De Brucker N, Vanhaecke F, Environmental science : processes &, impacts 17, 2034 (2015). http://doi.org/10.1039/C5EM00289C
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Ab initio modeling of few-layer dilute magnetic semiconductors”. Tiwari S, Van de Put ML, Sorée B, Vandenberghe WG, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2021, Dallas, TX , 141 (2021). http://doi.org/10.1109/SISPAD54002.2021.9592535
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Carrier transport in a two-dimensional topological insulator nanoribbon in the presence of vacancy defects”. Tiwari S, Van de Put ML, Sorée B, Vandenberghe WG, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 24-26, 2018, Austin, TX , 92 (2018). http://doi.org/10.1109/SISPAD.2018.8551720
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Urban soil exploration through multi-receiver electromagnetic induction and stepped-frequency ground penetrating radar”. Van de Vijver E, Van Meirvenne M, Vandenhaute L, Delefortrie S, De Smedt P, Saey T, Seuntjens P, Environmental science : processes &, impacts 17, 1271 (2015). http://doi.org/10.1039/C5EM00023H
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Ceramide cross-linking leads to pore formation: Potential mechanism behind CAP enhancement of transdermal drug delivery”. Van der Paal J, Fridman G, Bogaerts A, Plasma processes and polymers 16, 1900122 (2019). http://doi.org/10.1002/PPAP.201900122
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Influence of Gap Size and Dielectric Constant of the Packing Material on the Plasma Behaviour in a Packed Bed DBD Reactor: A Fluid Modelling Study: Influence of Gap Size and Dielectric Constant…”. Van Laer K, Bogaerts A, Plasma processes and polymers 14, 1600129 (2017). http://doi.org/10.1002/ppap.201600129
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Atomic structure of alloys close to phase transitions”. Van Tendeloo G, Schryvers D, Nucleation and growth processes in materials 580, 283 (2000)
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