| |
Author |
Title |
Year |
Publication  |
Volume |
Times cited |
Additional Links |
Links |
|
|
Prabhakara, V.; Jannis, D.; Béché, A.; Bender, H.; Verbeeck, J. |
Strain measurement in semiconductor FinFET devices using a novel moiré demodulation technique |
2019 |
Semiconductor science and technology |
|
8 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Verbist, K.; Lebedev, O.I.; Verhoeven, M.A.J.; Winchern, R.; Rijnders, A.J.H.M.; Blank, D.H.A.; Tafuri, F.; Bender, H.; Van Tendeloo, G. |
Microstructure of YBa2Cu3O7-\delta Josephson junctions in relation to their properties |
1998 |
Superconductor science and technology |
11 |
|
UA library record; WoS full record; WoS citing articles |
|
|
|
Ke, X.; Bals, S.; Romo Negreira, A.; Hantschel, T.; Bender, H.; Van Tendeloo, G. |
TEM sample preparation by FIB for carbon nanotube interconnects |
2009 |
Ultramicroscopy |
109 |
21 |
UA library record; WoS full record; WoS citing articles |
|
|
|
Prabhakara, V.; Jannis, D.; Guzzinati, G.; Béché, A.; Bender, H.; Verbeeck, J. |
HAADF-STEM block-scanning strategy for local measurement of strain at the nanoscale |
2020 |
Ultramicroscopy |
219 |
4 |
UA library record; WoS full record; WoS citing articles |
|
