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\bibitem{Tinck_etal2017} {\textquotedblleft}\textit{Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF$_{6}$/O$_{2}$plasmas}{\textquotedblright}. Tinck S, Tillocher T, Georgieva V, Dussart R, Neyts E, Bogaerts A, Plasma processes and polymers \textbf{14}, 1700018 (2017).   http://doi.org/10.1002/ppap.201700018

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