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\bibitem{Tinck_etal2013} {\textquotedblleft}\textit{Numerical investigation of SiO$_{2}$ coating deposition in wafer processing reactors with SiCl$_{4}$/O$_{2}$/Ar inductively coupled plasmas}{\textquotedblright}. Tinck S, De Schepper P, Bogaerts A, Plasma processes and polymers \textbf{10}, 714 (2013).   http://doi.org/10.1002/ppap.201300005

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