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\bibitem{Tinck_etal2011} {\textquotedblleft}\textit{Modeling Cl$_{2}$/O$_{2}$/Ar inductively coupled plasmas used for silicon etching : effects of SiO$_{2}$ chamber wall coating}{\textquotedblright}. Tinck S, Boullart W, Bogaerts A, Plasma sources science and technology \textbf{20}, 045012 (2011).   http://doi.org/10.1088/0963-0252/20/4/045012

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