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Author |
Title |
Year  |
Publication |
Volume |
Times cited |
Additional Links |
Links |
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Tinck, S.; Tillocher, T.; Georgieva, V.; Dussart, R.; Neyts, E.; Bogaerts, A. |
Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2plasmas |
2017 |
Plasma processes and polymers |
14 |
|
UA library record; WoS full record; WoS citing articles |
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Tinck, S.; Tillocher, T.; Dussart, R.; Neyts, E.C.; Bogaerts, A. |
Elucidating the effects of gas flow rate on an SF6inductively coupled plasma and on the silicon etch rate, by a combined experimental and theoretical investigation |
2016 |
Journal of physics: D: applied physics |
49 |
1 |
UA library record; WoS full record; WoS citing articles |
|
|
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Tinck, S.; Tillocher, T.; Dussart, R.; Bogaerts, A. |
Cryogenic etching of silicon with SF6 inductively coupled plasmas: a combined modelling and experimental study |
2015 |
Journal of physics: D: applied physics |
48 |
9 |
UA library record; WoS full record; WoS citing articles |
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