|
Author |
Title |
Year |
Publication |
Volume |
Times cited |
Additional Links |
Links |
|
Zhang, Y.-R.; Tinck, S.; De Schepper, P.; Wang, Y.-N.; Bogaerts, A. |
Modeling and experimental investigation of the plasma uniformity in CF4/O2 capacitively coupled plasmas, operating in single frequency and dual frequency regime |
2015 |
Journal of vacuum science and technology: A: vacuum surfaces and films |
33 |
3 |
UA library record; WoS full record; WoS citing articles |
|
|
Gul, B.; Tinck, S.; De Schepper, P.; Aman-ur-Rehman; Bogaerts, A. |
Numerical investigation of HBr/He transformer coupled plasmas used for silicon etching |
2015 |
Journal of physics: D: applied physics |
48 |
7 |
UA library record; WoS full record; WoS citing articles |
|
|
Tinck, S.; Altamirano-Sánchez, E.; De Schepper, P.; Bogaerts, A. |
Formation of a nanoscale SiO2 capping layer on photoresist lines with an Ar/SiCl4/O2 inductively coupled plasma : a modeling investigation |
2014 |
Plasma processes and polymers |
11 |
1 |
UA library record; WoS full record; WoS citing articles |
|
|
Tinck, S.; De Schepper, P.; Bogaerts, A. |
Numerical investigation of SiO2 coating deposition in wafer processing reactors with SiCl4/O2/Ar inductively coupled plasmas |
2013 |
Plasma processes and polymers |
10 |
3 |
UA library record; WoS full record; WoS citing articles |
|