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Author Title Year (down) Publication Volume Times cited Additional Links
Tinck, S.; Tillocher, T.; Georgieva, V.; Dussart, R.; Neyts, E.; Bogaerts, A. Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2plasmas 2017 Plasma processes and polymers 14 UA library record; WoS full record; WoS citing articles