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Author |
Title |
Year  |
Publication |
Volume |
Times cited |
Additional Links |
Links |
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Reyntjens, P.; Van de Put, M.; Vandenberghe, W.G.; Sorée, B. |
Ultrascaled graphene-capped interconnects : a quantum mechanical study |
2023 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany |
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UA library record; WoS full record |
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Deylgat, E.; Chen, E.; Sorée, B.; Vandenberghe, W.G. |
Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials |
2023 |
International Conference on Simulation of Semiconductor Processes and Devices : [proceedings]
T2 – International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan |
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UA library record; WoS full record |
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Tiwari, S.; Van de Put, M.; Sorée, B.; Hinkle, C.; Vandenberghe, W.G. |
Reduction of magnetic interaction due to clustering in doped transition-metal dichalcogenides : a case study of Mn-, V-, and Fe-doped WSe₂ |
2024 |
ACS applied materials and interfaces |
16 |
|
UA library record; WoS full record |
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