“Triple ion beam cutting of diamond/Al composites for interface characterization”. Ji G, Tan Z, Shabadi R, Li Z, Grünewald W, Addad A, Schryvers D, Zhang D, Materials characterization 89, 132 (2014). http://doi.org/10.1016/j.matchar.2014.01.008
Abstract: A novel triple ion beam cutting technique was employed to prepare high-quality surfaces of diamond/Al composites for interfacial characterization, which has been unachievable so far. Near-perfect and artifact-free surfaces were obtained without mechanical pre-polishing. Hence, the as-prepared surfaces are readily available for further study and also, ready to be employed in a focus ion beam system for preferential selection of transmission electron microscopy samples. Dramatically different diamond/Al interface configurations – sub-micrometer Al2O3 particles and clean interfaces were unambiguously revealed.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 2.714
Times cited: 9
DOI: 10.1016/j.matchar.2014.01.008
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“Heterogeneous interfacial chemical nature and bonds in a W-coated diamond/Al composite”. Ji G, Tan Z, Lu Y, Schryvers D, Li Z, Zhang D, Materials characterization 112, 129 (2016). http://doi.org/10.1016/j.matchar.2015.12.013
Abstract: Heterogeneous Al/Al4C3/Al2O3/diamond{111}, Al/nanolayered Al4C3/diamond{111} and Al12W particle/Al4C3/Al2O3/diamond{111} multi-interfaces have been developed at the nanoscale in a W-coated diamond/Al composite produced by vacuum hot pressing. The formation of nanoscale Al4C3 crystals is strongly associated with local O enrichment and can be further promoted by Al12W interfacial particles. The latter effectively contributes to enhance interfacial chemical bonding reducing interfacial thermal resistance and, in turn, enhancing thermal conductivity.
Keywords: A1 Journal article; Engineering sciences. Technology; Electron microscopy for materials research (EMAT)
Impact Factor: 2.714
Times cited: 7
DOI: 10.1016/j.matchar.2015.12.013
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“A quantitative method to characterize the Al4C3-formed interfacial reaction: the case study of MWCNT/Al composites”. Yan L, Tan Z, Ji G, Li Z, Fan G, Schryvers D, Shan A, Zhang D, Materials characterization 112, 213 (2015). http://doi.org/10.1016/j.matchar.2015.12.031
Abstract: The Al4C3-formed interfacial reaction plays an important role in tuning the mechanical and thermal properties of carbon/aluminum (C/Al) composites reinforced with carbonaceous materials such as multi-wall carbon nanotube (MWCNT) and graphene nanosheet. In terms of the hydrolysis nature of Al4C3, an electrochemical dissolution method was developed to quantitatively characterize the extent of C/Al interfacial reaction, which involves dissolving the composite samples in alkaline solution first, then collecting and measuring the CH4 gas released by Al4C3 hydrolysis with a gas chromatograph. Through a case study with powder metallurgy fabricated 2.0 wt.% MWCNT/Al composites, the detectability limit of the proposed method is 0.4 wt.% Al4C3, corresponding to 5 % extent of interfacial reaction with a measurement error of ±3 %. And then, with the already known MWCNT/Al reaction extent vs different sintering temperature and time, the reaction kinetics with an activation energy of 281 kJ mol-1 was successfully derived. Therefore, this rapid, sensitive, accurate method supplies an useful tool to optimize the processing and properties of all kinds of C/Al composites via interface design/control.
Keywords: A1 Journal article; Engineering sciences. Technology; Electron microscopy for materials research (EMAT)
Impact Factor: 2.714
Times cited: 24
DOI: 10.1016/j.matchar.2015.12.031
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“Aligning graphene in bulk copper : nacre-inspired nanolaminated architecture coupled with in-situ processing for enhanced mechanical properties and high electrical conductivity”. Cao M, Xiong D-B, Tan Z, Ji G, Amin-Ahmadi B, Guo Q, Fan G, Guo C, Li Z, Zhang D, Carbon 117, 65 (2017). http://doi.org/10.1016/J.CARBON.2017.02.089
Abstract: Methods used to strengthen metals generally also cause a pronounced decrease in ductility and electrical conductivity. In this work a bioinspired strategy is applied to surmount the dilemma. By assembling copper submicron flakes cladded with in-situ grown graphene, graphene/copper matrix composites with a nanolaminated architecture inspired by a natural nacre have been prepared. Owing to a combined effect-from the bioinspired nanolaminated architecture and improved interfacial bonding, a synergy has been achieved between mechanical strength and ductility as well as electrical conductivity in the graphene/copper matrix composites. With a low volume fraction of only 2.5% of graphene, the composite shows a yield strength and elastic modulus similar to 177% and similar to 25% higher than that of unreinforced copper matrix, respectively, while retains ductility and electrical conductivity comparable to that of pure copper. The bioinspired nanolaminated architecture enhances the efficiencies of two-dimensional (2D) graphene in mechanical strengthening and electrical conducting by aligning graphene to maximize performance for required loading and carrier transporting conditions, and toughens the composites by crack deflection. Meanwhile, in-situ growth of graphene is beneficial for improving interfacial bonding and structural quality of graphene. The strategy sheds light on the development of composites with good combined structural and functional properties. (C) 2017 Elsevier Ltd. All rights reserved.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
DOI: 10.1016/J.CARBON.2017.02.089
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“Effect of interface evolution on thermal conductivity of vacuum hot pressed SiC/Al composites”. Chen Z, Tan Z, Ji G, Schryvers D, Ouyang Q, Li Z, Advanced engineering materials 17, 1076 (2015). http://doi.org/10.1002/adem.201400412
Abstract: The SiC/Al composites have been fabricated by a vacuum hot pressing (VHP) process in order to study the effect of interface evolution on the global thermal conductivity (TC). By optimizing the VHP parameters of sintering temperature and time, the three different kinds of SiC/Al interface configurations, that is, non-bonded, diffusion-bonded, and reaction-bonded interfaces, are formed and identified by measurement of relative density, X-ray diffraction, scanning and (high-resolution) transmission electron microscopy. The VHPed composite sintered at 655 °C for 60 min is fully dense and presents a tightly-adhered and clean SiC/Al interface at the nanoscale, the ideal diffusion-bonded interface being the most favorable for minimizing interfacial thermal resistance, which in turn results in the highest TC of around 270 W/mK.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 2.319
Times cited: 9
DOI: 10.1002/adem.201400412
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