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“Structural and chemical effects on EELS L3,2 ionization edges in Ni-based intermetallic compounds”. Potapov PL, Kulkova SE, Schryvers D, Verbeeck J, Physical review : B : condensed matter and materials physics 64, 184110 (2001). http://doi.org/10.1103/PhysRevB.64.184110
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 3.836
Times cited: 44
DOI: 10.1103/PhysRevB.64.184110
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“Structure and microstructure of La1-xSrxMnO3 (x=0.16) films grown on a SrTiO3(110) substrate”. Lebedev OI, Verbeeck J, Van Tendeloo G, Amelinckx S, Ravazi FS, Habermeier H-U, Philosophical magazine: A: physics of condensed matter: defects and mechanical properties 81, 2865 (2001). http://doi.org/10.1080/01418610108217170
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 2.136
Times cited: 12
DOI: 10.1080/01418610108217170
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“TEM of ultra-thin DyBa2Cu3O7-x films deposited on TiO2 terminated SrTiO3”. Bals S, Rijnders G, Blank DHA, Van Tendeloo G, Physica: C : superconductivity 355, 225 (2001). http://doi.org/10.1016/S0921-4534(01)00034-X
Abstract: Using pulsed laser deposition ultra-thin DyBa2Cu3O7-x films were deposited on a single terminated (0 0 1) SrTiOr(3) substrate. The initial growth was studied by high-resolution electron microscopy. Two different types of interface arrangements occur and were determined as: bulk-SrO-TiO2-BaO-CuO-BaO-CuO2-Dy-CuO2-BaO bulk and bulk-SrO-TiO2-BaO-CuO2-Dy-CuO2-BaO-CuO-BaO-bulk This variable growth sequence causes structural shifts, resulting in antiphase boundaries with displacement vector R = [0 0 1/3]. as well as local chemical variations. (C) 2001 Elsevier Science B.V. All rights reserved.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 1.404
Times cited: 26
DOI: 10.1016/S0921-4534(01)00034-X
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“Transmission electron microscopy investigation of Bi-2223/Ag tapes”. Gottschalck Andersen L, Bals S, Van Tendeloo G, Poulsen HF, Liu YL, Physica: C : superconductivity 353, 251 (2001). http://doi.org/10.1016/S0921-4534(00)01755-X
Abstract: The microstructure of (Bi,Pb)2Sr2Ca2Cu3Ox (Bi-2223) tapes has been investigated by means of transmission electron microscopy (TEM) and high-resolution TEM. The emphasis has been placed on: (1) an examination of the grain morphology and size, (2) grain and colony boundary angles, which are formed during the tape processing, (3) a study of the grain boundaries on an atomic scale, including intergrowth investigations. Tapes with different process parameters have been compared with respect to the microstructure. A fully processed tape has on the average 50% thicker Bi-2223 grains than a tape after the first annealing. The angles of c-axis tilt grain boundaries are on average 14° and 26° for the fully processed tape and the tape after the first annealing, respectively. The intergrowth content (15%) and distribution are similar in these two tapes.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 1.404
Times cited: 13
DOI: 10.1016/S0921-4534(00)01755-X
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“Why are sputter deposited Nd1+xBa2-xCu3O7-\delta thin films flatter than NdBa2Cu3O7-\delta films?”.Bals S, Van Tendeloo G, Salluzzo M, Maggio-Aprile I, Applied physics letters 79, 3660 (2001). http://doi.org/10.1063/1.1421622
Abstract: High-resolution electron microscopy and scanning tunneling microscopy have been used to compare the microstructure of NdBa2Cu3O7-delta and Nd1+xBa2-xCu3O7-delta thin films. Both films contain comparable amounts of Nd2CuO4 inclusions. Antiphase boundaries are induced by unit cell high steps at the substrate or by a different interface stacking. In Nd1+xBa2-xCu3O7-delta the antiphase boundaries tend to annihilate by the insertion of extra Nd layers. Stacking faults, which can be characterized as local Nd2Ba2Cu4O9 inclusions, also absorb the excess Nd. A correlation is made between the excess Nd and the absence of growth spirals at the surface of the Nd-rich films. (C) 2001 American Institute of Physics.
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 3.411
Times cited: 13
DOI: 10.1063/1.1421622
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