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Author |
Title |
Year |
Publication |
Volume |
Times cited |
Additional Links |
Links |
|
Zografos, O.; Dutta, S.; Manfrini, M.; Vaysset, A.; Sorée, B.; Naeemi, A.; Raghavan, P.; Lauwereins, R.; Radu, I.P. |
Non-volatile spin wave majority gate at the nanoscale |
2017 |
AIP advances
T2 – 61st Annual Conference on Magnetism and Magnetic Materials (MMM), OCT 31-NOV 04, 2016, New Orleans, LA |
7 |
13 |
UA library record; WoS full record; WoS citing articles |
|
|
Dutta, S.; Zografos, O.; Gurunarayanan, S.; Radu, I.; Sorée, B.; Catthoor, F.; Naeemi, A. |
Proposal for nanoscale cascaded plasmonic majority gates for non-Boolean computation |
2017 |
Scientific reports |
7 |
2 |
UA library record; WoS full record; WoS citing articles |
|
|
De Clercq, M.; Moors, K.; Sankaran, K.; Pourtois, G.; Dutta, S.; Adelmann, C.; Magnus, W.; Sorée, B. |
Resistivity scaling model for metals with conduction band anisotropy |
2018 |
Physical review materials |
2 |
|
UA library record; WoS full record; WoS citing articles |
|
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Dutta, S.; Sankaran, K.; Moors, K.; Pourtois, G.; Van Elshocht, S.; Bommels, J.; Vandervorst, W.; Tokei, Z.; Adelmann, C. |
Thickness dependence of the resistivity of platinum-group metal thin films |
2017 |
Journal of applied physics |
122 |
42 |
UA library record; WoS full record; WoS citing articles |
|
|
Adelmann, C.; Sankaran, K.; Dutta, S.; Gupta, A.; Kundu, S.; Jamieson, G.; Moors, K.; Pinna, N.; Ciofi, I.; Van Elshocht, S.; Bommels, J.; Boccardi, G.; Wilson, C.J.; Pourtois, G.; Tokei, Z. |
Alternative Metals: from ab initio Screening to Calibrated Narrow Line Models |
2018 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA |
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|
UA library record; WoS full record; WoS citing articles |
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Sankaran, K.; Moors, K.; Dutta, S.; Adelmann, C.; Tokei, Z.; Pourtois, G. |
Metallic ceramics for low resitivity interconnects : an ab initio insight |
2018 |
Proceedings of the IEEE ... International Interconnect Technology Conference
T2 – IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA |
|
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UA library record; WoS full record; WoS citing articles |
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