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Author
Sankaran, K.
;
Clima, S.
;
Mees, M.
;
Adelmann, C.
;
Tokei, Z.
;
Pourtois, G.
Title
Exploring alternative metals to Cu and W for interconnects : an ab initio Insight
Type
P1 Proceeding
Year
2014
Publication
2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference (iitc/amc)
Abbreviated Journal
Volume
Issue
Pages
193-195
Keywords
P1 Proceeding; Engineering sciences. Technology; Plasma Lab for Applications in Sustainability and Medicine – Antwerp (PLASMANT)
Abstract
The properties of alternative metals to Cu and W for interconnect applications are reviewed based on first-principles simulations and benchmarked in terms of intrinsic bulk resistivity and electromigration.
Address
Corporate Author
Thesis
Publisher
Ieee
Place of Publication
New york
Editor
Language
Wos
Publication Date
0000-00-00
Series Editor
Series Title
Abbreviated Series Title
Series Volume
Series Issue
Edition
ISSN
978-1-4799-5018-8
ISBN
Additional Links
UA library record
;
WoS full record
;
Impact Factor
Times cited
Open Access
Notes
Approved
Most recent IF: NA
Call Number
UA @ lucian @ c:irua:127034
Serial
1149
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