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Alternative metals for advanced interconnects”. Adelmann C, Wen LG, Peter AP, Pourtois G, et al, 2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference (iitc/amc) , 173 (2014)
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Bloch and localized electrons in semiconductor superlattices”. Helm M, Hilber W, Fromherz T, Peeters FM, Alavi K, Pathak RN, Semiconductor science and technology 9, 1989 (1994). http://doi.org/10.1088/0268-1242/9/11S/022
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A comparative investigation of replication techniques used for the study of (S+Au) sensitized AgBr microcrystals”. Buschmann V, Schryvers D, van Landuyt J, van Roost C, de Keyzer R, The journal of imaging science and technology 40, 189 (1996)
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Comprehensive modelling network for dc glow discharges in argon”. Bogaerts A, Plasma sources science and technology 8, 210 (1999). http://doi.org/10.1088/0963-0252/8/2/003
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Critical assessment of the process of growth of a YBa2Cu3O7-\delta layer on Y2BaCuO5”. Jacques P, Verbist K, Lapin J, Ryelandt L, Van Tendeloo G, Delannay F, Superconductor science and technology 9, 176 (1996). http://doi.org/10.1088/0953-2048/9/3/008
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Effect of deposition rate on the microstructure of electron beam evaporated nanocrystalline palladium thin films”. Amin-Ahmadi B, Idrissi H, Galceran M, Colla MS, Raskin JP, Pardoen T, Godet S, Schryvers D, Thin solid films : an international journal on the science and technology of thin and thick films 539, 145 (2013). http://doi.org/10.1016/j.tsf.2013.05.083
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Effect of selenium content of CuInSex alloy nanopowder precursors on recrystallization of printed CuInSe2 absorber layers during selenization heat treatment”. E Zaghi A, Buffière M, Koo J, Brammertz G, Batuk M, Verbist C, Hadermann J, Kim WK, Meuris M, Poortmans J, Vleugels J;, Thin solid films : an international journal on the science and technology of thin and thick films , 1 (2014). http://doi.org/10.1016/j.tsf.2014.10.003
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Electron energy distribution function in capacitively coupled RF discharges: differences between electropositive Ar and electronegative SiH4 discharges”. Yan M, Bogaerts A, Goedheer WJ, Gijbels R, Plasma sources science and technology 9, 583 (2000). http://doi.org/10.1088/0963-0252/9/4/314
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Exploring alternative metals to Cu and W for interconnects : an ab initio Insight”. Sankaran K, Clima S, Mees M, Adelmann C, Tokei Z, Pourtois G, 2014 Ieee International Interconnect Technology Conference / Advanced Metallization Conference (iitc/amc) , 193 (2014)
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Formation of diamond nanocrystals in laser-irradiated amorphous carbon films”. Nistor LC, van Landuyt J, Ralchenko VG, Kononenko TV, Obraztsova ED, Strelnitsky VE, International Conference on the New Diamond Science and Technology 4, 25 (1994)
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Growth of La2Mo2O9 films on porous Al2O3 substrates by radio frequency magnetron sputtering”. Laffez P, Chen XY, Banerjee G, Pezeril T, Rossell MD, Van Tendeloo G, Lacorre P, Liu JM, Liu Z-G, Thin solid films : an international journal on the science and technology of thin and thick films 500, 27 (2006). http://doi.org/10.1016/j.tsf.2005.10.062
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Hollow cathode discharges with gas flow: numerical modelling for the effect on the sputtered atoms and the deposition flux”. Bogaerts A, Okhrimovskyy A, Baguer N, Gijbels R, Plasma sources science and technology 14, 191 (2005). http://doi.org/10.1088/0963-0252/14/1/021
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Hot magneto-phonon and electro-phonon resonances in heterostructures”. Peeters FM, Devreese JT, Semiconductor science and technology: B 7, 15 (1992). http://doi.org/10.1088/0268-1242/7/3B/004
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Influence of the Ar/O2 ratio on the growth and biaxial alignment of yttria stabilized zirconia layers during reactive unbalanced magnetron sputtering”. Mahieu S, Ghekiere P, de Winter G, Depla D, de Gryse R, Lebedev OI, Van Tendeloo G, Thin solid films : an international journal on the science and technology of thin and thick films 484, 18 (2005). http://doi.org/10.1016/j.tsf.2005.01.021
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Influence of twinning on the morphology of AgBr and AgCl microcrystals”. van Renterghem W, Goessens C, Schryvers D, van Landuyt J, Bollen D, de Keyzer R, van Roost C, The journal of imaging science and technology 45, 349 (2001)
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The ion- and atom-induced secondary electron emission yield: numerical study for the effect of clean and dirty cathode surfaces”. Bogaerts A, Gijbels R, Plasma sources science and technology 11, 27 (2002). http://doi.org/10.1088/0963-0252/11/1/303
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Low- or high-angle Ar ion-beam etching to create ramp-type Josephson junctions”. Verbist K, Lebedev OI, Van Tendeloo G, Verhoeven MAJ, Rijnders AJHM, Blank DHA, Superconductor science and technology 9, 978 (1996). http://doi.org/10.1088/0953-2048/9/11/009
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Microstructure of YBa2Cu3O7-\delta Josephson junctions in relation to their properties”. Verbist K, Lebedev OI, Verhoeven MAJ, Winchern R, Rijnders AJHM, Blank DHA, Tafuri F, Bender H, Van Tendeloo G, Superconductor science and technology 11, 13 (1998). http://doi.org/10.1088/0953-2048/11/1/004
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Microstructure of YBa2Cu3O7-x films on buffered Si for microelectronic applications”. Vasiliev AL, Van Tendeloo G, Boikov Y, Olsson E, Ivanov S, Superconductor science and technology 10, 356 (1997)
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Modeling of gas discharge plasmas: What can we learn from it?”.Bogaerts A, de Bleecker K, Kolev I, Madani M, Surface and coatings technology 200, 62 (2005). http://doi.org/10.1016/j.surfcoat.2005.02.057
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New method to determine the parity of the number of twin planes in tabular silver halide microcrystals from top views”. Goessens C, Schryvers D, van Landuyt J, de Keyzer R, The journal of imaging science and technology 41, 301 (1997)
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Novel nonlinear transport phenomena in a triangular quantum well”. Kastalsky A, Peeters FM, Chan WK, Florez LT, Harbison JP, Semiconductor science and technology: B 7, 530 (1992). http://doi.org/10.1088/0268-1242/7/3B/138
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Numerical modelling of gas discharge plasmas for various applications”. Bogaerts A, Gijbels R, Vacuum: surface engineering, surface instrumentation &, vacuum technology 69, 37 (2003). http://doi.org/10.1016/S0042-207X(02)00306-8
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Oscillating sliding wear of mono- and multilayer ceramic coatings in air”. Huq MZ, Celis JP, Meneve J, Stals L, Schryvers D, Surface and coatings technology 113, 242 (1999). http://doi.org/10.1016/S0257-8972(99)00009-2
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Plasma characteristics of an Ar/CF4/N2 discharge in an asymmetric dual frequency reactor: numerical investigation by a PIC/MC model”. Georgieva V, Bogaerts A, Plasma sources science and technology 15, 368 (2006). http://doi.org/10.1088/0963-0252/15/3/010
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Point defect reactions in silicon studies in situ by high flux electron irradiation in high voltage transmission electron microscope”. Vanhellemont J, Romano-Rodriguez A, Fedina L, van Landuyt J, Aseev A, Materials science and technology 11, 1194 (1995)
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Quantitative determination of C60 and C70 in soot extracts by high performance liquid chromatography and mass spectrometric characterization”. van Cleempoel A, Gijbels R, Zhu D, Claeys M, Richter H, Fonseca A, Fullerene science and technology 4, 1001 (1996). http://doi.org/10.1080/10641229608001158
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Surface processes during purification of InP quantum dots”. Mordvinova N, Emelin P, Vinokurov A, Dorofeev S, Abakumov A, Kuznetsova T, Beilstein journal of nanotechnology 5, 1220 (2014). http://doi.org/10.3762/bjnano.5.135
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TEM study of B2 + L12 decomposition in a nanoscale Ni-rich Ni-Al film”. Schryvers D, Yandouzi M, Toth L, Thin solid films : an international journal on the science and technology of thin and thick films 326, 126 (1998). http://doi.org/10.1016/S0040-6090(98)00545-8
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A TEM study of non-parallel twins inducing thickness growth in silver chloride {111} tabular crystals”. van Renterghem W, Schryvers D, van Landuyt J, Bollen D, van Roost C, de Keyzer R, The journal of imaging science and technology 45, 83 (2001)
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