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Author
Title
Year
Publication
Volume
Times cited
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Tinck, S.
;
Tillocher, T.
;
Georgieva, V.
;
Dussart, R.
;
Neyts, E.
;
Bogaerts, A.
Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF
6
/O
2
plasmas
2017
Plasma processes and polymers
14
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