“Reliability of copper dual damascene influenced by pre-clean”. Tokei Z, Lanckmans F, van den Bosch G, Van Hove M, Maex K, Bender H, Hens S, van Landuyt J, Analysis Of Integrated Circuits , 118 (2002). http://doi.org/10.1109/IPFA.2002.1025629
Keywords: P1 Proceeding; Electron microscopy for materials research (EMAT)
Times cited: 5
DOI: 10.1109/IPFA.2002.1025629
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“Stress analysis with convergent beam electron diffraction around NMOS transistors”. Stuer G, Bender H, van Landuyt J, Eyben P, , 359 (2001)
Keywords: P1 Proceeding; Electron microscopy for materials research (EMAT); Internet Data Lab (IDLab)
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“TEM characterization of extended defects induced in Si wafers by H-plasma treatment”. Ghica C, Nistor LC, Bender H, Richard O, Van Tendeloo G, Ulyashin A, Journal of physics: D: applied physics 40, 395 (2007). http://doi.org/10.1088/0022-3727/40/2/016
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 2.588
Times cited: 10
DOI: 10.1088/0022-3727/40/2/016
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“Thermal stability of atomic layer deposited Zr:Al mixed oxide thin films: an in situ transmission electron microscopy study”. Nistor LC, Richard O, Zhao C, Bender H, Van Tendeloo G, Journal of materials research 20, 1741 (2005). http://doi.org/10.1557/JMR.2005.0217
Keywords: A1 Journal article; Electron microscopy for materials research (EMAT)
Impact Factor: 1.673
DOI: 10.1557/JMR.2005.0217
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