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Author Neelisetty, K.K.; Kumar C.N., S.; Kashiwar, A.; Scherer, T.; Chakravadhanula, V.S.K.; Kuebel, C.
Title Novel thin film lift-off process for in situ TEM tensile characterization Type A1 Journal article
Year (down) 2021 Publication Microscopy And Microanalysis Abbreviated Journal Microsc Microanal
Volume 27 Issue S1 Pages 216-217
Keywords A1 Journal article; Engineering sciences. Technology; Electron microscopy for materials research (EMAT)
Abstract
Address
Corporate Author Thesis
Publisher Place of Publication Editor
Language Wos Publication Date 2021-07-30
Series Editor Series Title Abbreviated Series Title
Series Volume Series Issue Edition
ISSN 1431-9276 ISBN Additional Links UA library record
Impact Factor 1.891 Times cited Open Access Not_Open_Access
Notes Approved Most recent IF: 1.891
Call Number UA @ admin @ c:irua:183617 Serial 6873
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Author Gorji, S.; Kashiwar, A.; Mantha, L.S.; Kruk, R.; Witte, R.; Marek, P.; Hahn, H.; Kübel, C.; Scherer, T.
Title Nanowire facilitated transfer of sensitive TEM samples in a FIB Type A1 Journal article
Year (down) 2020 Publication Ultramicroscopy Abbreviated Journal Ultramicroscopy
Volume 219 Issue Pages 113075
Keywords A1 Journal article; Engineering sciences. Technology; Electron microscopy for materials research (EMAT)
Abstract We introduce a facile approach to transfer thin films and other mechanically sensitive TEM samples inside a FIB with minimal introduction of stress and bending. The method is making use of a pre-synthetized flexible freestanding Ag nanowire attached to the tip of a typical tungsten micromanipulator inside the FIB. The main advantages of this approach are the significantly reduced stress-induced bending during transfer and attachment of the TEM sample, the very short time required to attach and cut the nanowire, the operation at very low dose and ion current, and only using the e-beam for Pt deposition during the transfer of sensitive TEM samples. This results in a reduced sample preparation time and reduced exposure to the ion beam or e-beam for Pt deposition during the sample preparation and thus also reduced contamination and beam damage. The method was applied to a number of thin films and different TEM samples in order to illustrate the advantageous benefits of the concept. In particular, the technique has been successfully tested for the transfer of a thin film onto a MEMS heating chip for in situ TEM experiments.
Address
Corporate Author Thesis
Publisher Place of Publication Editor
Language Wos Publication Date 2020-07-15
Series Editor Series Title Abbreviated Series Title
Series Volume Series Issue Edition
ISSN 0304-3991 ISBN Additional Links UA library record
Impact Factor 2.2 Times cited Open Access
Notes Approved Most recent IF: 2.2; 2020 IF: 2.843
Call Number UA @ admin @ c:irua:183618 Serial 6871
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