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  Author Title Year Publication Volume (down) Times cited Additional Links Links
Lou, W.-K. The electrical properties of low low dimensional topological insulators 2012 UA library record pdf
Vargas Paredes, A.A. Emergent phenomena in superconductors in presence of intraband and cross-band pairing 2020 UA library record url
Stosic, D. High-performance Ginzburg-Landau simulations of superconductivity 2018 UA library record file
Stosic, D. Numerical simulations of magnetic skyrmions in atomically-thin ferromagnetic films 2018 UA library record file
Milovanović, S.P.; Peeters, F.M. Strained graphene structures : from valleytronics to pressure sensing 2018 Nanostructured Materials For The Detection Of Cbrn 6 UA library record; WoS full record; WoS citing articles pdf doi
Xiao, Y. Theoretical study of the optoelectronic properties of new type 2DEG materials : multilayer graphene and monolayer MoS2 2017 UA library record
Taghizadeh Sisakht, E. Tight-binding investigation of the electronic properties of phosphorene and phosphorene nanoribbons 2019 UA library record file
Nakhaee, M. Tight-binding model for two-dimensional materials 2020 UA library record url
Conti, S.; Chaves, A.; Pandey, T.; Covaci, L.; Peeters, F.M.; Neilson, D.; Milošević, M.V. Flattening conduction and valence bands for interlayer excitons in a moire MoS₂/WSe₂ heterobilayer 2023 Nanoscale UA library record; WoS full record; WoS citing articles url doi
Vizarim, N.P. Dynamic behavior of Skyrmions under the influence of periodic pinning in chiral magnetic infinite thin films 2023 UA library record url
Hassani, H. First-principles study of polarons in WO₃ 2023 UA library record url
Hasnat Rubel, A. Theoretical characterization and optimization of nano-engineered superconducting scanning probe tip 2023 UA library record file
Reyntjens, P.; Van de Put, M.; Vandenberghe, W.G.; Sorée, B. Ultrascaled graphene-capped interconnects : a quantum mechanical study 2023 Proceedings of the IEEE ... International Interconnect Technology Conference T2 – IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany UA library record; WoS full record pdf doi
Reijniers, J.; Partoens, B.; Peremans, H. Noise-resistant correlation-based alignment of head-related transfer functions for high-fidelity spherical harmonics representation 2023 UA library record
Deylgat, E.; Chen, E.; Sorée, B.; Vandenberghe, W.G. Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials 2023 International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 – International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan UA library record; WoS full record pdf doi
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