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List View
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Citations
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Details
Author
Title
Year
Publication
Volume
Times cited
Additional Links
Lou, W.-K.
The electrical properties of low low dimensional topological insulators
2012
UA library record
Vargas Paredes, A.A.
Emergent phenomena in superconductors in presence of intraband and cross-band pairing
2020
UA library record
Stosic, D.
High-performance Ginzburg-Landau simulations of superconductivity
2018
UA library record
Stosic, D.
Numerical simulations of magnetic skyrmions in atomically-thin ferromagnetic films
2018
UA library record
Milovanović, S.P.
;
Peeters, F.M.
Strained graphene structures : from valleytronics to pressure sensing
2018
Nanostructured Materials For The Detection Of Cbrn
6
UA library record
;
WoS full record
;
WoS citing articles
Xiao, Y.
Theoretical study of the optoelectronic properties of new type 2DEG materials : multilayer graphene and monolayer MoS
2
2017
UA library record
Taghizadeh Sisakht, E.
Tight-binding investigation of the electronic properties of phosphorene and phosphorene nanoribbons
2019
UA library record
Nakhaee, M.
Tight-binding model for two-dimensional materials
2020
UA library record
Conti, S.
;
Chaves, A.
;
Pandey, T.
;
Covaci, L.
;
Peeters, F.M.
;
Neilson, D.
;
Milošević, M.V.
Flattening conduction and valence bands for interlayer excitons in a moire MoS₂/WSe₂ heterobilayer
2023
Nanoscale
UA library record
;
WoS full record
;
WoS citing articles
Vizarim, N.P.
Dynamic behavior of Skyrmions under the influence of periodic pinning in chiral magnetic infinite thin films
2023
UA library record
Hassani, H.
First-principles study of polarons in WO₃
2023
UA library record
Hasnat Rubel, A.
Theoretical characterization and optimization of nano-engineered superconducting scanning probe tip
2023
UA library record
Reyntjens, P.
;
Van de Put, M.
;
Vandenberghe, W.G.
;
Sorée, B.
Ultrascaled graphene-capped interconnects : a quantum mechanical study
2023
Proceedings of the IEEE ... International Interconnect Technology Conference T2 – IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany
UA library record
;
WoS full record
Reijniers, J.
;
Partoens, B.
;
Peremans, H.
Noise-resistant correlation-based alignment of head-related transfer functions for high-fidelity spherical harmonics representation
2023
UA library record
Deylgat, E.
;
Chen, E.
;
Sorée, B.
;
Vandenberghe, W.G.
Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials
2023
International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 – International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan
UA library record
;
WoS full record
