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Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials”. Deylgat E, Chen E, Sorée B, Vandenberghe WG, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan , 45 (2023). http://doi.org/10.23919/SISPAD57422.2023.10319537
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