toggle visibility
Search within Results:
Display Options:
Number of records found: 2235

Select All    Deselect All
 | 
Citations
 | 
   print
Lou W-K (2012) The electrical properties of low low dimensional topological insulators. 186 p
toggle visibility
Vargas Paredes AA (2020) Emergent phenomena in superconductors in presence of intraband and cross-band pairing. 142 p
toggle visibility
Stosic D (2018) High-performance Ginzburg-Landau simulations of superconductivity. 166 p
toggle visibility
Stosic D (2018) Numerical simulations of magnetic skyrmions in atomically-thin ferromagnetic films. 153 p
toggle visibility
Strained graphene structures : from valleytronics to pressure sensing”. Milovanović, SP, Peeters FM, Nanostructured Materials For The Detection Of Cbrn , 3 (2018). http://doi.org/10.1007/978-94-024-1304-5_1
toggle visibility
Xiao Y (2017) Theoretical study of the optoelectronic properties of new type 2DEG materials : multilayer graphene and monolayer MoS2. 144 p
toggle visibility
Taghizadeh Sisakht E (2019) Tight-binding investigation of the electronic properties of phosphorene and phosphorene nanoribbons. 150 p
toggle visibility
Nakhaee M (2020) Tight-binding model for two-dimensional materials. 139 p
toggle visibility
Flattening conduction and valence bands for interlayer excitons in a moire MoS₂/WSe₂, heterobilayer”. Conti S, Chaves A, Pandey T, Covaci L, Peeters FM, Neilson D, Milošević, MV, Nanoscale , 1 (2023). http://doi.org/10.1039/D3NR01183F
toggle visibility
Vizarim NP (2023) Dynamic behavior of Skyrmions under the influence of periodic pinning in chiral magnetic infinite thin films. 212 p
toggle visibility
Hassani H (2023) First-principles study of polarons in WO₃. 181 p
toggle visibility
Hasnat Rubel A (2023) Theoretical characterization and optimization of nano-engineered superconducting scanning probe tip. viii, 145 p
toggle visibility
Ultrascaled graphene-capped interconnects : a quantum mechanical study”. Reyntjens P, Van de Put M, Vandenberghe WG, Sorée B, Proceedings of the IEEE ... International Interconnect Technology Conference T2 –, IEEE International Interconnect Technology Conference (IITC) / IEEE, Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023, Dresden, Germany , 1 (2023). http://doi.org/10.1109/IITC/MAM57687.2023.10154656
toggle visibility
Noise-resistant correlation-based alignment of head-related transfer functions for high-fidelity spherical harmonics representation”. Reijniers J, Partoens B, Peremans H, (2023)
toggle visibility
Quantum transport study of contact resistance of edge- and top-contacted two-dimensional materials”. Deylgat E, Chen E, Sorée B, Vandenberghe WG, International Conference on Simulation of Semiconductor Processes and Devices : [proceedings] T2 –, International Conference on Simulation of Semiconductor Processes and, Devices (SISPAD), SEP 27-29, 2023, Kobe, Japan , 45 (2023). http://doi.org/10.23919/SISPAD57422.2023.10319537
toggle visibility
Select All    Deselect All
 | 
Citations
 | 
   print

Save Citations:
Export Records: