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Design and construction of an experimental setup to enhance mineral weathering through the activity of soil organisms”. Calogiuri T, Hagens M, Van Groenigen JW, Corbett T, Hartmann J, Hendriksen R, Janssens I, Janssens IA, Ledesma Dominguez G, Loescher G, Mortier S, Neubeck A, Niron H, Poetra RP, Rieder L, Struyf E, Van Tendeloo M, De Schepper T, Verdonck T, Vlaeminck SE, Vicca S, Vidal A, Journal of visualized experiments , e65563 (2023). http://doi.org/10.3791/65563
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Quantitative HAADF STEM of SiGe in presence of amorphous surface layers from FIB preparation”. Grieb T, Tewes M, Schowalter M, Müller-Caspary K, Krause FF, Mehrtens T, Hartmann J-M, Rosenauer A, Ultramicroscopy 184, 29 (2018). http://doi.org/10.1016/J.ULTRAMIC.2017.09.012
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Strain mapping with nm-scale resolution for the silicon-on-insulator generation of semiconductor devices by advanced electron microscopy”. Cooper D, Denneulin T, Barnes J-P, Hartmann J-M, Hutin L, Le Royer C, Béché, A, Rouvière J-L, Applied Physics Letters 112, 124505 (2012). http://doi.org/10.1063/1.4767925
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Depth strain profile with sub-nm resolution in a thin silicon film using medium energy ion scattering”. Jalabert D, Pelloux-Gervais D, Béché, A, Hartmann JM, Gergaud P, Rouvière JL, Canut B, Physica Status Solidi A-Applications And Materials Science 209, 265 (2012). http://doi.org/10.1002/PSSA.201127502
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The reduction of the substitutional C content in annealed Si/SiGeC superlattices studied by dark-field electron holography”. Denneulin T, Rouvière JL, Béché, A, Py M, Barnes JP, Rochat N, Hartmann JM, Cooper D, Semiconductor science and technology 26, 1 (2011). http://doi.org/10.1088/0268-1242/26/12/125010
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