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Author Akamine, H.; Mitsuhara, M.; Nishida, M.; Samaee, V.; Schryvers, D.; Tsukamoto, G.; Kunieda, T.; Fujii, H. pdf  url
doi  openurl
  Title Precipitation behaviors in Ti-2.3 Wt Pct Cu alloy during isothermal and two-step aging Type A1 Journal article
  Year (down) 2021 Publication Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science Abbreviated Journal Metall Mater Trans A  
  Volume 52 Issue Pages 2760-2772  
  Keywords A1 Journal article; Engineering sciences. Technology; Electron microscopy for materials research (EMAT)  
  Abstract Time evolution of precipitates related to age-hardening in Ti-2.3 wt pct Cu alloys was investigated by electron microscopy. In isothermal aging at 723 K, the hardness increases continuously owing to precipitation strengthening, whereas in two-step aging where the aging temperature is switched from 673 K to 873 K after 100 hours, the hardness is found to drastically drop after the aging temperature switches. In isothermal aging, metastable and stable precipitates are independently nucleated, whereas characteristic V-shaped clusters of precipitates are observed during the two-step aging. It is revealed by atomic-scale observations that the V-shaped clusters are composed of metastable and stable precipitates and each type of precipitate has a different orientation relationship with the alpha phase: (10 (3) over bar)//(0001)(alpha) and [0 (1) over bar0]//respectively. The drop in hardness during two-step aging can be explained by a synergistic effect of decreased precipitation strengthening and solid solution strengthening. (C) The Minerals, Metals & Materials Society and ASM International 2021  
  Address  
  Corporate Author Thesis  
  Publisher Place of Publication Editor  
  Language Wos 000644823000001 Publication Date 2021-04-27  
  Series Editor Series Title Abbreviated Series Title  
  Series Volume Series Issue Edition  
  ISSN 1073-5623 ISBN Additional Links UA library record; WoS full record  
  Impact Factor 1.874 Times cited Open Access OpenAccess  
  Notes Approved Most recent IF: 1.874  
  Call Number UA @ admin @ c:irua:178222 Serial 6786  
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Author Idrissi, H.; Turner, S.; Mitsuhara, M.; Wang, B.; Hata, S.; Coulombier, M.; Raskin, J.-P.; Pardoen, T.; Van Tendeloo, G.; Schryvers, D. doi  openurl
  Title Point defect clusters and dislocations in FIB irradiated nanocrystalline aluminum films : an electron tomography and aberration-corrected high-resolution ADF-STEM study Type A1 Journal article
  Year (down) 2011 Publication Microscopy and microanalysis Abbreviated Journal Microsc Microanal  
  Volume 17 Issue 6 Pages 983-990  
  Keywords A1 Journal article; Electron microscopy for materials research (EMAT)  
  Abstract Focused ion beam (FIB) induced damage in nanocrystalline Al thin films has been characterized using advanced transmission electron microscopy techniques. Electron tomography was used to analyze the three-dimensional distribution of point defect clusters induced by FIB milling, as well as their interaction with preexisting dislocations generated by internal stresses in the Al films. The atomic structure of interstitial Frank loops induced by irradiation, as well as the core structure of Frank dislocations, has been resolved with aberration-corrected high-resolution annular dark-field scanning TEM. The combination of both techniques constitutes a powerful tool for the study of the intrinsic structural properties of point defect clusters as well as the interaction of these defects with preexisting or deformation dislocations in irradiated bulk or nanostructured materials.  
  Address  
  Corporate Author Thesis  
  Publisher Place of Publication Cambridge, Mass. Editor  
  Language Wos 000297832300018 Publication Date 2011-10-27  
  Series Editor Series Title Abbreviated Series Title  
  Series Volume Series Issue Edition  
  ISSN 1431-9276;1435-8115; ISBN Additional Links UA library record; WoS full record; WoS citing articles  
  Impact Factor 1.891 Times cited 25 Open Access  
  Notes Iap; Fwo Approved Most recent IF: 1.891; 2011 IF: 3.007  
  Call Number UA @ lucian @ c:irua:93627 Serial 2653  
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