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Interpretation of TOF-SIMS depth profiles from ultrashallow high-k dielectric stacks assisted by hybrid collisional computer simulation”. Ignatova VA, Möller W, Conard T, Vandervorst W, Gijbels R, Applied physics A : materials science &, processing 81, 71 (2005). http://doi.org/10.1007/s00339-005-3239-8
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